Syndant-TCPP is mainly applied to / hard PU foam, epoxy resin, polystyrene, acrylic acid, cellulose acetate, ethyl cellulose resin, Bakelite, polyvinyl acetate, and foam gap filler. Especially for thermal conduction of hard PU foam and stability of hydrolyze, as well as for the synthetic PU foam and saturation resin and Bakelite with low viscosity under low temperature.